Rencz, Marta : rechercher sur Z-Library

Sensors and Actuators A: Physical

Année:

2000

Langue:

english

Fichier:

PDF, 600 KB

english, 2000

CMOS temperature sensors and built-in test circuitry for thermal testing of ICs

V. Székely, M. Rencz, S. Török, Cs. Márta, L. Lipták-Fegó

Journal:

Année:

1998

Langue:

english

Fichier:

PDF, 935 KB

english, 1998

[IEEE 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Paris, France (2015.9.30-2015.10.2)] 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Effect of the trench depth on the linear mode capability of trench technology MOSFET-s

Jamborhazi, Szilard, Czett, Andor, Rencz, Marta

Année:

2015

Langue:

english

Fichier:

PDF, 763 KB

english, 2015

Foreword

Rencz, Marta, Lasance, Clemens

Journal:

Journal of Electronic Packaging

Année:

2001

Langue:

english

Fichier:

PDF, 151 KB

english, 2001

Design for thermal testability (DfTT) and a CMOS realization

V. Székely, Cs. Márta, M. Rencz, Zs. Benedek, B. Courtois

Journal:

Sensors and Actuators A: Physical

Année:

1996

Langue:

english

Fichier:

PDF, 418 KB

english, 1996

Package hermeticity testing with thermal transient measurements

András Vass-Várnai, Márta Rencz

Journal:

Microsystem Technologies

Année:

2009

Langue:

english

Fichier:

PDF, 405 KB

english, 2009

Alternative technology used to manufacture semitransparent monocrystalline silicon solar cells

Enikő Bándy, Márta Rencz

Journal:

Microsystem Technologies

Année:

2013

Langue:

english

Fichier:

PDF, 832 KB

english, 2013

A thermal benchmark chip: design and applications

Szekely, V., Marta, C., Rencz, M., Vegh, G., Benedek, Z., Torok, S.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Année:

1998

Langue:

english

Fichier:

PDF, 474 KB

english, 1998

[IEEE 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) - Budapest, Hungary (2007.09.17-2007.09.19)] 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) - Short time die attach characterization of semiconductor devices

Szabo, Peter, Rencz, Marta

Année:

2007

Langue:

english

Fichier:

PDF, 420 KB

english, 2007

A Methodology for the Co-Simulation of Dynamic Compact Models of Packages With the Detailed Models of Boards

Rencz, MÁrta, Szekely, Vladimir, Poppe, AndrÁs

Journal:

IEEE Transactions on Components and Packaging Technologies

Année:

2007

Langue:

english

Fichier:

PDF, 1.03 MB

english, 2007

[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Mission profile driven component design for adjusting product lifetime on system level

Szel, Attila, Sarkany, Zoltan, Bein, Marton, Bornoff, Robin, Vass-Varnai, Andras, Rencz, Marta

Année:

2015

Langue:

english

Fichier:

PDF, 468 KB

english, 2015

To the Special section constructed from the selected papers of Thermal investigations of integrated circuits and systems, THERMINIC’15

Journal:

Poór, Adrienn Katalin, Brodszky, Valentin, Péntek, Márta, Gulácsi, László, Ruzsa, Gábor, Hidvégi, Bernadett, Holló, Péter, Kárpáti, Sarolta, Sárdy, Miklós, Rencz, Fanni

Année:

2016

Langue:

english

Fichier:

PDF, 120 KB

english, 2016

Is the DLQI appropriate for medical decision-making in psoriasis patients?

Journal:

Archives of Dermatological Research

Année:

2017

Langue:

english

Fichier:

PDF, 766 KB

english, 2017

[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - The influence of the cycling parameters on the reliability test results of IGBTs

Sarkany, Zoltan, Rencz, Marta

Année:

2017

Langue:

english

Fichier:

PDF, 254 KB

english, 2017

Towards the CFD model of flow rate dependent enzyme-substrate reactions in nanoparticle filled flow microreactors

Pálovics, Péter, Ender, Ferenc, Rencz, Márta

Journal:

Palovics, Peter, Rencz, Marta

Année:

2018

Langue:

english

Fichier:

PDF, 1.78 MB

english, 2018

[IEEE 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Roma (2018.5.22-2018.5.25)] 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Simulation of the magnetic nanoparticle filling procedure of microchambers

Année:

2018

Langue:

english

Fichier:

PDF, 978 KB

english, 2018

To the special issue constructed from the selected papers of Thermal investigations of integrated circuits and systems, THERMINIC'17

Codecasa, Lorenzo, Rencz, Marta

Journal:

Année:

2018

Langue:

english

Fichier:

PDF, 115 KB

english, 2018

Thermal Investigations of Integrated Circuits and Systems, THERMINIC'09

Journal of Electronic Packaging

Journal:

Année:

2011

Langue:

english

Fichier:

PDF, 56 KB

english, 2011

[IEEE 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Hannover, Germany (2019.3.24-2019.3.27)] 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Numerical modelling of magnetic nanoparticle dynamics in microfluidic devices

Palovics, Peter, Rencz, Marta

Année:

2019

Langue:

english

Fichier:

PDF, 246 KB

english, 2019

[IEEE 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Paris, France (2019.5.12-2019.5.15)] 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - CFD modelling of magnetic nanoparticle suspension in microfluidics

Palovics, Peter, Nemeth, Marton, Rencz, Marta

Année:

2019

Langue:

english

Fichier:

PDF, 1011 KB

english, 2019

Thermal investigations of integrated circuits in systems at THERMINIC’05

Journal:

Année:

2007

Langue:

english

Fichier:

PDF, 62 KB

english, 2007

Thermal investigations of integrated circuits in systems at THERMINIC’07

Márta Rencz

Journal:

Année:

2009

Langue:

english

Fichier:

PDF, 85 KB

english, 2009

Foreword:Thermal investigations of integrated circuits and systems at THERMINIC’04

Journal:

Péter Szabó, Balázs Németh, Márta Rencz

Année:

2006

Langue:

english

Fichier:

PDF, 54 KB

english, 2006

Thermal transient characterisation of the etching quality of micro electro mechanical systems

Journal:

Année:

2009

Langue:

english

Fichier:

PDF, 633 KB

english, 2009

New possibilities in the thermal evaluation, offered by transient testing

Journal:

Année:

2003

Langue:

english

Fichier:

PDF, 423 KB

english, 2003

Thermal investigations of integrated circuits and systems at THERMINIC'02

Journal:

Année:

2003

Langue:

english

Fichier:

PDF, 49 KB

english, 2003

Thermal investigations of integrated circuits and systems, THERMINIC'10

Journal:

András Vass-Várnai, Zoltán Sárkány, Márta Rencz

Année:

2012

Langue:

english

Fichier:

PDF, 69 KB

english, 2012

Characterization method for thermal interface materials imitating an in-situ environment

Journal:

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Année:

2012

Langue:

english

Fichier:

PDF, 1.23 MB

english, 2012

CMOS sensors for on-line thermal monitoring of VLSI circuits

Szekely, V., Marta, C., Kohari, Z., Rencz, M.

Journal:

Année:

1997

Langue:

english

Fichier:

PDF, 747 KB

english, 1997

Thermal investigations of integrated circuits in systems at THERMINIC'11

Journal:

Bándy, Enikő, Rencz,, Márta

Année:

2013

Langue:

english

Fichier:

PDF, 100 KB

english, 2013

Thermal behaviour of new crystalline semitransparent solar cell structure

Journal:

The European Journal of Health Economics

Année:

2013

Langue:

english

Fichier:

PDF, 5.59 MB

english, 2013

Transferability of results of cost utility analyses for biologicals in inflammatory conditions for Central and Eastern European countries

Gulácsi, László, Rencz, Fanni, Péntek, Márta, Brodszky, Valentin, Lopert, Ruth, Hevér, Noémi V., Baji, Petra

Journal:

Année:

2014

Langue:

english

Fichier:

PDF, 266 KB

english, 2014

Exploring the relationship between EQ-5D, DLQI and PASI, and mapping EQ-5D utilities: a cross-sectional study in psoriasis from Hungary

Herédi, Emese, Rencz, Fanni, Balogh, Orsolya, Gulácsi, László, Herszényi, Krisztina, Holló, Péter, Jókai, Hajnalka, Kárpáti, Sarolta, Péntek, Márta, Remenyik, Éva, Szegedi, Andrea, Brodszky, Valentin

Journal:

The European Journal of Health Economics

Année:

2014

Langue:

english

Fichier:

PDF, 223 KB

english, 2014

Real-time heating and power characterization of cells in standard cell designs

Journal:

Sarkany, Zoltan, Vass-Varnai, Andras, Hantos, Gusztav, Rencz, Marta

Année:

2013

Langue:

english

Fichier:

PDF, 1.38 MB

english, 2013

[IEEE Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium - San Jose, CA, USA (2007.03.18-2007.03.22)] Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium - DELPHI Style Compact Modeling of Stacked Die Packages

Poppe, Andras, Farkas, Gabor, Parry, John, Szabo, Peter, Rencz, Marta, Szekely, Vladimir

Année:

2007

Langue:

english

Fichier:

PDF, 672 KB

english, 2007

[IEEE 2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Berlin, Germany (2013.09.25-2013.09.27)] 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Failure prediction of IGBT modules based on power cycling tests

Année:

2013

Langue:

english

Fichier:

PDF, 1.39 MB

english, 2013

[IEEE 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems (THERMINIC) - Rome, Italy (2008.09.24-2008.09.26)] 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems - FPGA power model for minimizing the thermal dissipation

Vamos, Abel, Rencz, Marta

Année:

2008

Langue:

english

Fichier:

PDF, 427 KB

english, 2008

[IEEE International Conference on Microelectronic Test Structures - Trento, Italy (25-28 March 1996)] Proceedings of International Conference on Microelectronic Test Structures - Test structure for thermal monitoring

Szekely, V., Kohari, Zs., Marta, Cs., Rencz, M., Courtois, B.

Année:

1996

Langue:

english

Fichier:

PDF, 630 KB

english, 1996

[IEEE 2010 IEEE 16th International Mixed-Signals, Sensors and Systems Test Workshop (IMS3TW 2010) - La Grande Motte, France (2010.06.7-2010.06.9)] 2010 IEEE 16th International Mixed-Signals, Sensors and Systems Test Workshop (IMS3TW) - Simulating and monitoring the resonant frequency of MEMS for failure detection and prediction

Jamborhazi, Szilard, Hegedus, Istvan, Rencz, Marta

Année:

2010

Langue:

english

Fichier:

PDF, 495 KB

english, 2010

[IEEE 2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Berlin, Germany (2013.09.25-2013.09.27)] 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Logi-thermal simulation using high-resolution temperature dependent delay models

Année:

2013

Langue:

english

Fichier:

PDF, 539 KB

english, 2013

[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Testing Interface Thermal Resistance

Bandy, Eniko, Foldvary, Arpad, Rencz, Marta

Année:

2007

Langue:

english

Fichier:

PDF, 358 KB

english, 2007

[IEEE 2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Berlin, Germany (2013.09.25-2013.09.27)] 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - The effect of heat treatment on spin-on oxide glasses in solar cell application

Année:

2013

Langue:

english

Fichier:

PDF, 1001 KB

english, 2013

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Measurement based compact thermal model creation - accurate approach to neglect inaccurate TIM conductivity data

Vass-Varnai, Andras, Bornoff, Robin, Sarkany, Zoltan, Ress, Sandor, Rencz, Marta

Année:

2011

Langue:

english

Fichier:

PDF, 743 KB

english, 2011

[IEEE 2007 IEEE Design and Diagnostics of Electronic Circuits and Systems - Krakow, Poland (2007.04.11-2007.04.13)] 2007 IEEE Design and Diagnostics of Electronic Circuits and Systems - Design issues of a low frequency low-pass filter for medical applications using CMOS technology

Vass-Varnai, Andras, Furjes, Peter, Rencz, Marta

Année:

2007

Langue:

english

Fichier:

PDF, 302 KB

english, 2007

[IEEE 2008 Twenty-fourth Annual IEEE Semionductor Thermal Measurement and Management Symposium - San Jose, CA, USA (2008.03.16-2008.03.20)] 2008 Twenty-fourth Annual IEEE Semionductor Thermal Measurement and Management Symposium - Electro-thermal and Logi-thermal Simulators aimed at the Temperature-aware Design of Complex Integrated Circuits

Poppe, Andras, Horvath, Gyorgy, Nagy, Gergely, Rencz, Marta, Szekely, Vladimir

Année:

2008

Langue:

english

Fichier:

PDF, 799 KB

english, 2008

[IEEE 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems (THERMINIC) - Rome, Italy (2008.09.24-2008.09.26)] 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems - Possibilities of humidity sensing with thermal transient testing on porous structures

Année:

2008

Langue:

english

Fichier:

PDF, 1.08 MB

english, 2008

[IEEE 2012 13th Latin American Test Workshop - LATW - Quito, Ecuador (2012.04.10-2012.04.13)] 2012 13th Latin American Test Workshop (LATW) - Acquiring real-time heating of cells in standard cell designs

Année:

2012

Langue:

english

Fichier:

PDF, 962 KB

english, 2012

[IEEE 2011 12th Latin American Test Workshop - LATW - Beach of Porto de Galinhas, Brazil (2011.03.27-2011.03.30)] 2011 12th Latin American Test Workshop (LATW) - Studying the influence of chip temperatures on timing integrity

Année:

2011

Langue:

english

Fichier:

PDF, 582 KB

english, 2011

[IEEE 2006 International Biennial Baltic Electronics Conference - Tallinn, Estonia (2006.10.2-2006.10.4)] 2006 International Biennial Baltic Electronics Conference - Thermal qualification of 3D stacked die structures